Samsung Electronics Co.'s latest 12-layer HBM3E chips are undergoing successful testing in collaboration with its customers. The company is working closely with various partners to ensure the technology and performance of the chips meet the highest standards. Samsung Electronics is committed to continuously improving the quality and credibility of its entire product range to provide optimal solutions to its customers. Despite recent reports of testing challenges with US AI chip giant Nvidia, Samsung Electronics aims to commence mass production of its 12-layer HBM3E products in the second quarter. The HBM technology, which is in high demand, especially for Nvidia's graphics processing units, is a crucial component for AI computing. Samsung's decision to revamp its chip business leadership highlights its dedication to enhancing competitiveness in the thriving AI chip market, where Korean chip giant SK hynix Inc. currently holds a strong position and is the primary supplier to Nvidia. (Yonhap)