SK Chairman Chey Tae-won and TSMC Chairman C.C. Wei have agreed to enhance their collaboration in the development of advanced artificial intelligence chips, particularly the highly sought-after High Bandwidth Memory chips. Chey's visit to Taiwan to meet with Wei and other IT leaders is part of SK's efforts to strengthen its network and gain a competitive advantage in the rapidly growing global AI market. During the meeting, Chey expressed his vision for opening the door to an era of artificial intelligence that benefits humanity, emphasizing the shared commitment between the two companies. The collaboration between SK hynix and TSMC aims to develop the sixth-generation HBM4 memory chip and cutting-edge packaging technology, leveraging TSMC's advanced logic process to enhance the functionality of the HBM4 base die. SK hynix is set to commence mass production of HBM4 in 2025, while also focusing on optimizing its HBM production capability and working with TSMC's Chip on Wafer on Substrate technology. Chey's proactive efforts to strengthen ties with global tech leaders reflect SK's commitment to enhancing Korea's technological competence and the company's position in the global market. This includes previous visits to ASML in the Netherlands and meetings with Nvidia's CEO to explore potential business partnerships and reinforce existing collaborations.