Samsung Electronics, the leading revenue-generating memory chip manufacturer, has initiated mass production of the industry's thinnest 12-nanometer LPDDR5X DRAM chip, designed to enhance thermal control in mobile devices. This ultraslim DRAM chip, available in 12- and 16-gigabyte storage options, aims to free up space within mobile devices to improve airflow, thereby facilitating more effective thermal management. This is particularly crucial for high-performance applications with advanced features, such as on-device artificial intelligence, according to the company's statement. Samsung's executive vice president of memory product planning, Bae Yong-cheol, emphasized that the LPDDR5X DRAM not only delivers superior performance but also incorporates advanced thermal management in a compact package. The company achieved this by optimizing printed circuit board and epoxy molding compound techniques, resulting in a 0.65-millimeter thin LPDDR DRAM package, the thinnest among existing 12GB or higher LPDDR DRAM products. Additionally, Samsung reduced the thickness by approximately 9 percent and improved heat resistance by about 21.2 percent compared to the previous generation's product through a 4-stack structure and an optimized back-lapping process. Samsung plans to expand its presence in the low-power DRAM market by supplying the 0.65mm LPDDR5X DRAM to mobile processor makers and mobile device manufacturers. Furthermore, the company aims to develop even thinner LPDDR DRAM packages, including 6-layer 24GB and 8-layer 32GB modules, to meet the increasing demand for high-performance, high-density mobile memory solutions in smaller package sizes. This is crucial for enabling on-device AI features without relying on cloud servers, and Samsung has been at the forefront of LPDDR DRAM chip development, introducing the world's first 8GB capacity chip in 2018 and the LPDDR5X DRAM model in 2021.