Samsung Electronics has refuted a Reuters report claiming that its fifth-generation HBM3E chip has passed Nvidia's qualification test, stating it is still undergoing testing with major clients. Despite an earlier report suggesting that Samsung had cleared Nvidia's qualification test for its HBM3E chip, Samsung denies the news, asserting that the products are still in the review process by clients. Although no client names were disclosed, the company has insisted that the news of a pending supply deal with Nvidia is unfounded. The qualification test for Samsung's HBM3E chips by Nvidia has been highly anticipated, as it remains to be seen whether Nvidia will choose to utilize Samsung's chips. Despite speculations about a potential delay in Nvidia's decision to accept supply from Samsung, Samsung has affirmed its plans to start supplying the 8-layer HBM3E chip in the third quarter of this year, with a more advanced 12-layer product planned for release by the end of the year. Additionally, the HBM market is expected to be dominated by Samsung and SK hynix, with predictions for HBM3E to become the mainstream product in the second half of this year, and Samsung aiming to commence production of the sixth-generation HBM4 within the first half of next year.
Samsung Electronics has refuted a Reuters report claiming that its fifth-generation HBM3E chip has passed Nvidia's qualification test, stating it is still undergoing testing with major clients. Despite an earlier report suggesting that Samsung had cleared Nvidia's qualification test for its HBM3E chip, Samsung denies the news, asserting that the products are still in the review process by clients. Although no client names were disclosed, the company has insisted that the news of a pending supply deal with Nvidia is unfounded. The qualification test for Samsung's HBM3E chips by Nvidia has been highly anticipated, as it remains to be seen whether Nvidia will choose to utilize Samsung's chips. Despite speculations about a potential delay in Nvidia's decision to accept supply from Samsung, Samsung has affirmed its plans to start supplying the 8-layer HBM3E chip in the third quarter of this year, with a more advanced 12-layer product planned for release by the end of the year. Additionally, the HBM market is expected to be dominated by Samsung and SK hynix, with predictions for HBM3E to become the mainstream product in the second half of this year, and Samsung aiming to commence production of the sixth-generation HBM4 within the first half of next year.